Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-04-19
2005-04-19
Thai, Luan (Department: 2827)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C257S679000, C029S601000, C029S600000
Reexamination Certificate
active
06881605
ABSTRACT:
There is disclosed a method of forming a card embedded with an integrated circuit (IC) and an antenna coil, which method including the steps of (a) embedding an antenna coil onto a core sheet; (b) laminating the core sheet with a number of outer sheets to form a laminated panel; (c) forming a first cavity in the laminated panel to expose part of the antenna coil; (d) pulling out two ends of the antenna coil from the core sheet; and (e) securing the integrated circuit with the antenna coil, e.g. by soldering or thermo compression bonding.
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Search Report-Republic of France, Dec. 12, 2002.
Kwan Kwok Lam
Lee Chi Keung
Billion Apex Limited
Pravel James W.
Pravel Intellectual Property Law, P.C.
Thai Luan
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