Method of forming a device package having edge interconnect pad

Details Method of forming a device package having edge interconnect pad Method of forming a device package having edge interconnect pad

2005-10-14

2009-06-02

Mulpuri, Savitri (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

C438S051000

Reexamination Certificate

active

07541209

ABSTRACT:
A method of forming a device package having an edge interconnect pad includes forming an array of MEMS devices overlaying at least one conductive via that electrically connects to an underlying layer. The method continues with depositing, by way of a damascene process, a conductive material on a substrate that is coplanar with the array of MEMS devices, the conductive material coupling to the at least one conductive via. The method also includes covering the array of MEMS devices and the conductive material with a passivation layer.

REFERENCES:
patent: 6479320 (2002-11-01), Gooch
patent: 6696343 (2004-02-01), Chinthakindi et al.
patent: 6815220 (2004-11-01), Crawford et al.
patent: 6924165 (2005-08-01), Horning et al.
patent: 6936491 (2005-08-01), Partridge et al.
patent: 7045459 (2006-05-01), Freidhoff
patent: 7402907 (2008-07-01), Ohguro
patent: 2003/0153116 (2003-08-01), Carley et al.
patent: 2005/0067633 (2005-03-01), Mushika
patent: 2006/0125084 (2006-06-01), Fazzio et al.
patent: 2006/0208326 (2006-09-01), Nasiri et al.
patent: 2007/0004096 (2007-01-01), Heuvelman
patent: 2007/0035001 (2007-02-01), Kuhmann et al.
patent: 2007/0128828 (2007-06-01), Chen et al.
patent: WO2005/061376 (2005-07-01), None

Affiliated with

Also associated with

Rating

Method of forming a device package having edge interconnect pad does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming a device package having edge interconnect pad, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming a device package having edge interconnect pad will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4056281