Method of forming a device

Semiconductor device manufacturing: process – Making passive device – Stacked capacitor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S255000

Reexamination Certificate

active

07091101

ABSTRACT:
A method of forming a device is disclosed. The method includes forming a capacitor, and forming the capacitor includes forming a first electrode. The first electrode includes at least one non-smooth surface and is formed from a material selected from the group consisting of transition metals, conductive oxides, alloys thereof, and combinations thereof. Forming the capacitor also includes forming a dielectric on the first electrode, and forming a second electrode on the dielectric. The second electrode includes at least one non-smooth surface.

REFERENCES:
patent: 5245206 (1993-09-01), Chu et al.
patent: 5313089 (1994-05-01), Jones, Jr.
patent: 5392189 (1995-02-01), Fazan et al.
patent: 5444013 (1995-08-01), Akram et al.
patent: 5478772 (1995-12-01), Fazan
patent: 5563089 (1996-10-01), Jost et al.
patent: 5563090 (1996-10-01), Lee et al.
patent: 5604696 (1997-02-01), Takaishi
patent: 5622893 (1997-04-01), Summerfelt et al.
patent: 5824590 (1998-10-01), New
patent: 5856937 (1999-01-01), Chu et al.
patent: 5866453 (1999-02-01), Prall et al.
patent: 6077742 (2000-06-01), Chen et al.
patent: 6087694 (2000-07-01), Ohno et al.
patent: 6090660 (2000-07-01), Noble, Jr.
patent: 6090704 (2000-07-01), Kim et al.
patent: 6114199 (2000-09-01), Isobe et al.
patent: 6153898 (2000-11-01), Watanabe et al.
patent: 6153903 (2000-11-01), Clampitt
patent: 6165834 (2000-12-01), Agarwal et al.
patent: 6171925 (2001-01-01), Graettinger et al.
patent: 6191443 (2001-02-01), Al-Shareef et al.
patent: 6222722 (2001-04-01), Fukuzumi et al.
patent: 6265260 (2001-07-01), Alers et al.
patent: 6284655 (2001-09-01), Marsh
patent: 6507065 (2003-01-01), Figura et al.
patent: 2003/0057472 (2003-03-01), Gealy et al.
patent: 2003/0080369 (2003-05-01), Gealy et al.
patent: 2003/0100164 (2003-05-01), Gealy et al.
U.S. Appl. No. 09/286,807, filed Apr. 6, 1999, Gealy et al.
U.S. Appl. No. 09/770,699, filed Jan. 26, 2001, Gealy et al.
U.S. Appl. No. 10/159,695, filed May 30, 2002, Gealy et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of forming a device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming a device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming a device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3621014

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.