Semiconductor device manufacturing: process – Having organic semiconductive component
Reexamination Certificate
2011-06-21
2011-06-21
Landau, Matthew C (Department: 2813)
Semiconductor device manufacturing: process
Having organic semiconductive component
C257S040000, C257SE51024, C257SE51027
Reexamination Certificate
active
07964443
ABSTRACT:
A method of forming a crossed wire molecule device comprising a plurality of bottom electrodes, a plurality of top electrodes crossing the bottom electrodes at a non-zero angle, and a self-assembled molecular film chemically bonded to a surface of each of the bottom electrodes is provided. The self-assembled molecular film includes one or more defect sites and a plurality of active device molecules, each of the plurality of active device molecules including a molecular switching moiety having a self-assembling connecting group at one end of the moiety and a linking group at an opposed end of the moiety. The polymeric material chemically bonds to at least some of the linking groups of the plurality of active device molecules, causing the formation of the self-assembled molecular layer covering the plurality of active device molecules and the defect site(s). A molecular switching device is also provided.
REFERENCES:
patent: 6128214 (2000-10-01), Kuekes
patent: 6451942 (2002-09-01), Li
patent: 6459095 (2002-10-01), Heath
patent: 6562398 (2003-05-01), Braach-Maksvytis
patent: 6674932 (2004-01-01), Zhang
patent: 2002/0176276 (2002-11-01), Zhang
patent: 2005/0001317 (2005-01-01), Ganapathiraman
patent: 0268370 (1988-05-01), None
patent: 0506368 (1992-09-01), None
patent: 1355323 (2003-10-01), None
patent: 02/095810 (2002-11-01), None
patent: 2006/005016 (2006-01-01), None
International Search Report for S.N. PCT/US2005/023323, dated Jul. 6, 2006 (5 pages).
Leung Sui-Hing
Zhang Sean X.
Hewlett--Packard Development Company, L.P.
Landau Matthew C
Snow Colleen E
LandOfFree
Method of forming a crossed wire molecular device including... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of forming a crossed wire molecular device including..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming a crossed wire molecular device including... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2709793