Method of forming a copper film on a ceramic body

Details Method of forming a copper film on a ceramic body Method of forming a copper film on a ceramic body

1986-06-27

1990-10-23

Silverberg, Sam

Metal treatment

Process of modifying or maintaining internal physical...

Processes of coating utilizing a reactive composition which...

427 96, 148282, C23C 810

Patent

active

049649230

ABSTRACT:
A film containing copper is deposited on a ceramic body, and the film and the ceramic body are heated in an oxidizing atmosphere, whereby the copper is oxidized and bonded to the body to form a metal oxide film thereon. Alternatively, a film containing copper oxide is deposited on a ceramic body, and the film and the ceramic body are heated in a non-reducing atmosphere, whereby the film is bonded to the body to form a metal oxide film thereon. A metal film consisting mainly of copper is deposited on the metal oxide film. The metal film and the metal oxide film are heated at a temperature not exceeding 1083.degree. C. in a non-oxidizing atmosphere, whereby a copper film is formed on the body.

REFERENCES:
patent: 3944440 (1976-03-01), Franz
patent: 4525383 (1985-06-01), Saito

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