Method of forming a contoured laminate

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156285, 264 92, 264278, 296137A, 427207R, B29C 1704

Patent

active

040522415

ABSTRACT:
A method of bonding a flexible superstrate, such as a flexible finish sheet, to a contoured substrate, such as a contoured fiberboard, particularly in mass production. The disclosed method includes supporting the contoured substrate in a downwardly facing cavity of a female die. The substrate may be coated with adhesive before receipt in the die cavity. A flexible superstrate is then positioned beneath the die cavity on a flexible sealing sheet. The die is then closed and a vacuum is drawn through the die cavity and contoured substrate to draw the sealing sheet into the die cavity. The flexible superstrate or finish sheet is thus drawn in face-to-face contact with the contoured face of the substrate, bonding the finish sheet to the substrate.

REFERENCES:
patent: 1458732 (1923-06-01), Sloper
patent: 2361343 (1944-10-01), Dickson et al.
patent: 3072520 (1963-01-01), Groth
patent: 3325329 (1967-06-01), Bolesky
patent: 3554834 (1971-01-01), Bennett et al.
patent: 3556315 (1971-01-01), Berger
patent: 3589967 (1971-06-01), Shirakawa
patent: 3654012 (1902-04-01), Schlager
patent: 3654019 (1972-04-01), Cusick
patent: 3657044 (1972-04-01), Singer

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