Method of forming a continuous glass coating over the surface of

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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156643, 427 96, 4273762, H05K 328

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active

046235566

ABSTRACT:
A method is disclosed for forming a continuous glass coating which is free of pinholes, cracks, and the like over the surface of an electrical device. In the method disclosed, a mixture consisting essentially of an organic vehicle which is reactive with a suitable plasma to form gaseous reaction products at a temperature below the thermal decomposition temperature of the organic vehicle and a glass frit having a glass transition temperature above the thermal degradation temperature is applied in a layer over the surface of a completed electrical device. The applied layer of the mixture is then subjected to a suitable plasma at a temperature below the thermal degradation temperature of the organic vehicle for a time sufficient to remove the organic vehicle from the layer. The layer is then heated to or above the glass transition temperature of the glass frit until the glass frit fuses and forms a continuous defect-free glass coating over the surface of the electrical device.

REFERENCES:
patent: 3935330 (1976-01-01), Smith et al.
patent: 4201579 (1980-05-01), Robinson et al.
patent: 4241165 (1980-12-01), Hughes et al.
patent: 4341820 (1982-07-01), Taylor
patent: 4401709 (1983-08-01), Prabhy
patent: 4555303 (1985-11-01), Leggs
M. Leahy, "Plasma Etching for Integrated Circuit Fabrication," RCA Engineer, 30-5, Sep./Oct. 1985, pp. 75-82.

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