Method of forming a contact bump

Details Method of forming a contact bump Method of forming a contact bump

1987-12-03

1989-06-06

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174 685, 361406, H05K 300

Patent

active

048358592

ABSTRACT:
A contact bump is formed on a sheet of electrically-conductive material by plastically deforming the sheet so as to form a depression at one side of the sheet and a corresponding bump at the opposite side of the sheet. Solid material is placed in the depression, and the sheet of electrically-conductive material is secured at its one side to a support member.

REFERENCES:
patent: 3374400 (1968-03-01), Tabuchi et al.
patent: 4000054 (1976-12-01), Marcantonio
patent: 4420767 (1983-12-01), Hodge et al.
patent: 4421944 (1983-12-01), Desmarais, Jr.
IBM Tech. Discl. Bull., vol. 5, No. 6, Nov. 1962, pp. 37-38 by Kaweck et al.
IBM Tech. Discl. Bull., vol. 7, No. 6, Nov. 1964, pp. 469-470 by Feth.
IBM Tech. Discl. Bull., vol. 11, No. 8, Jan. 1969, p. 962 by Hermann.
IBM Tech. Discl. Bull., vol. 18, No. 9, Feb. 1976, p. 2817 by Ward.

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