Metal working – Method of mechanical manufacture – Electrical device making
Patent
1992-06-19
1993-08-24
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29874, 29884, 361772, 439 66, 439 74, 439 91, 439 95, H01R 4316
Patent
active
052377431
ABSTRACT:
A method of forming conductive end portions on a flexible circuit member having a dielectric layer (e.g., polyimide) with at least one conductive element (e.g., copper) thereon. The method comprises the steps of forming (e.g., punching) an opening through both dielectric and conductive element, providing (e.g., additive plating) an electrically conducting layer on the opening's internal surface, providing (e.g., electroplating) a plurality of dendritic elements on the conducting layer's surface, and thereafter removing (e.g., punching) a portion of the dielectric and conductive element such that the formed dendritic elements (e.g., palladium) project from the flexible circuit's conductive ends.
REFERENCES:
patent: 3679940 (1972-07-01), Newman et al.
patent: 3941442 (1976-10-01), Friend
patent: 3960423 (1976-06-01), Weisenburger
patent: 3960424 (1976-06-01), Weisenburger
patent: 4027935 (1977-06-01), Byrnes et al.
patent: 4295700 (1981-10-01), Sado
patent: 4505529 (1985-10-01), Barkus
patent: 4634199 (1987-01-01), Anhalt et al.
patent: 4636018 (1987-01-01), Stillie
patent: 4655519 (1987-04-01), Evans et al.
patent: 4764848 (1988-08-01), Simpson
patent: 4793814 (1988-12-01), Zifcak et al.
patent: 4818634 (1989-04-01), Bliss
patent: 4824391 (1989-04-01), Ii
patent: 4875863 (1989-10-01), Reed
patent: 4943242 (1990-07-01), Frankeny et al.
patent: 4998885 (1991-03-01), Beaman
patent: 4998886 (1991-03-01), Werner
patent: 5037311 (1991-08-01), Frankeny et al.
patent: 5049084 (1991-09-01), Bakke
patent: 5061192 (1991-10-01), Chapin et al.
patent: 5137461 (1992-08-01), Bindra et al.
IBM Technical Discl. Bull., vol. 19, No. 12, May 1977, pp. 4686-4687 by K. F. Greene et al.
IBM Technical Discl. Bull., vol. 20, No. 4, Sep. 1977, pp. 1522-1523 by E. G. Loeffel et al.
Research Disclosure, Jan., 1990, No. 309 (30964), "Dendrite Connectors for Low Temperature System Packaging".
Research Disclosure, Apr., 1991, No. 324 (32470), "Height Adjustable Disconnectable Electrical Mini Links".
Busacco Raymond A.
Chapin Fletcher W.
Dranchak David W.
Molla Jaynal A.
Saxenmeyer Jr. George J.
Arbes Carl J.
Fraley Lawrence R.
International Business Machines - Corporation
LandOfFree
Method of forming a conductive end portion on a flexible circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of forming a conductive end portion on a flexible circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming a conductive end portion on a flexible circuit will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-821434