Method of forming a conductive contact bump on a flexible substr

Details Method of forming a conductive contact bump on a flexible substr Method of forming a conductive contact bump on a flexible substr

1991-02-05

1992-03-17

Echols, P. W.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174261, 29846, 29852, H05K 100

Patent

active

050971018

ABSTRACT:
A flexible circuit board is formed from a sheet of polyimide having a contact pad on its first side and a continuous layer of copper on its second side by removing copper from the second side so as to leave at least one discrete island that confronts the pad through the sheet of insulating material, and applying force to the island in the direction from the second side toward the first side, whereby the island is deformed plastically to form a dimple and the pad is deformed plastically to form a bump.

REFERENCES:
patent: 2912745 (1959-11-01), Steigerwalt et al.
patent: 4116517 (1978-09-01), Selvin et al.
patent: 4173712 (1979-11-01), Purser
patent: 4396457 (1983-08-01), Bakermans
patent: 4403272 (1983-08-01), Larson et al.
patent: 4736277 (1988-04-01), Brown
patent: 4784972 (1988-11-01), Hatada
patent: 4835859 (1989-06-01), Beckett

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