Metal fusion bonding – Process – Using only pressure
Patent
1981-09-21
1982-12-07
Weidenfeld, Gil
Metal fusion bonding
Process
Using only pressure
228243, 228263G, B23K 2004
Patent
active
043622623
ABSTRACT:
Novel and advantageous metal laminates particularly useful in making coins comprising a copper core and a cladding metallurgically bonded thereto of a copper base alloy containing from 2 to 3.5% aluminum, from 1 to 2.5% silicon and the balance essentially copper. Disclosure also teaches a method of preparing copper laminates by providing a copper core in strip form in the hard temper and a copper alloy cladding fully annealed in strip form, wherein the components are rolled together in a single pass with a reduction of from 50 to 75% to provide the metallurgically bonded laminate.
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Semiatin, S. L. et al., "Formability of Sandwich Sheet Materials in Plane Strain Compression and Rolling", Met. Trans. A., AIME, vol. 10A, Jan. 1979, pp. 97-106.
Brenneman William
Fister Julius C.
Winter Joseph
Cohn Howard M.
Kelmachter Barry L.
Olin Corporation
Silverberg Fred A.
Weidenfeld Gil
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