Method of forming a composite film over the surface of aluminum

Chemistry: electrical and wave energy – Processes and products

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204376, 204 383, 204 42, C25D 1104, C25D 1122

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active

049683896

ABSTRACT:
A method of forming a coposite film over the surface of aluminum materials, for forming an aluminum oxide film over the surface of an aluminum material, and metal deposits in the aluminum oxide film so as to connect electrically with the aluminum material, in which a voltage is applied to the aluminum material immersed in a sulfuric acid solution to form an aluminum oxide film having pores over the surface of the aluminum material; then the voltage is dropped sharply to near zero while the aluminum material is immersed in the sulfuric acid solution, and a voltage of approximately 0.1 V or less is applied to the aluminum material to dissolve the aluminum oxide film forming the bottoms of the pores; and then the aluminum material coated with the aluminum oxide film is nickel-plated through electroplating to form nickel deposits in the pores of the aluminum oxide film so that the nickel deposts connect electrically with the aluminum material.

REFERENCES:
patent: 3915811 (1975-10-01), Tremmel et al.
patent: 3962049 (1976-06-01), Ueki
patent: 4394415 (1983-07-01), Tsuda
patent: 4548682 (1985-10-01), Yoshida et al.
F. A. Lowenheim, Electroplating, McGraw-Hill Book Co., New York, 1978, pp. 12-16, 465-467.
F. A. Lowenheim, Electroplating, McGraw-Hill Book Co., New York, 1978, pp. 211-212, 460-464.
S. Wernick & R. Pinner, The Surface Treatment and Finishing of Aluminum, Robert Draper Ltd., Teddington, 1964, pp. 260-269.

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