Method of forming a circuit board with integral terminals

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

174 685, 339 17LC, 156223, 156226, 156227, 156268, H05K 304, H05K 322

Patent

active

041640713

ABSTRACT:
A circuit board having a die stamped conductive pattern is produced having terminals which are integral with the conductive pattern on the board. A first embodiment is produced by folding the conductive material over a designated terminal edge of the board to obtain commonly connected terminals on opposite sides of the board. The second embodiment is produced by extending the conductive material past the terminal edge of the board and folding the material 180.degree. to obtain an integral blade terminal extending from the board.

REFERENCES:
patent: 2647852 (1953-08-01), Franklin
patent: 2753619 (1956-07-01), Franklin
patent: 3302067 (1967-01-01), Jackson et al.
patent: 3474297 (1969-10-01), Bylander
patent: 3573345 (1971-04-01), Devries
patent: 3694660 (1972-09-01), LaBranche et al.
patent: 3698079 (1972-10-01), Lifschitz
patent: 3723635 (1973-03-01), Smith
patent: 3898535 (1975-08-01), Ebbert
patent: 3911716 (1975-10-01), Weglin

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