Method of forming a circuit board

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

174 685, 264104, 361401, 29848, 29829, H05K 330

Patent

active

044021356

ABSTRACT:
A circuit board is fabricated by injection molding a support of an insulating material. The support is provided with channels in the pattern of conductive paths. The channels are filled by injection with electrically conductive plastic, and electrically conductive metal is precipitated galvanoplastically on the plastic.

REFERENCES:
patent: 3339008 (1967-08-01), MacArthur et al.
patent: 4034467 (1977-07-01), Sapunarow et al.
patent: 4157407 (1979-06-01), Peiffer
IBM Tech. Discl. Bull., vol. 2, No. 1, Jun. 1959, p. 9.

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