Method of forming a chip package and package interconnects

Details Method of forming a chip package and package interconnects Method of forming a chip package and package interconnects

1992-09-01

1993-06-08

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29827, 29840, 174 524, 206332, 361404, H05K 116

Patent

active

052168069

ABSTRACT:
A method of packaging an integrated circuit chip having an active surface with a pattern of input/output pads. A package member is positioned to frame the integrated circuit chip, leaving a gap between the active chip surface and an interconnect support surface of the package member. A filler material is deposited within the gap, simultaneously fixing the chip to the package member and providing a bridge that is coplanar with the active and interconnect support surfaces. A pattern of conductive printed circuit interconnects is preferably photolithographically formed from the input/output pads to an edge of the package member. The resulting structure can then be electrically connected to a substrate, such as a printed circuit board, by bonding the interconnects to contact sites on the substrate. Optionally, a number of integrated circuit chips can be connected to a single package member to form a multi-chip module.

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