Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With mating connector which receives panel circuit edge
Patent
1995-04-19
1996-06-18
Tsai, H. Jey
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With mating connector which receives panel circuit edge
437919, H01L 2170, H01L 2700
Patent
active
055277306
ABSTRACT:
An insulating film is formed on the surface of the base of a semiconductor, and a portion of the insulating film is removed to cause the surface to appear outside. The exposed surface is terminated with hydrogen, and then energy beams are applied to selectively remove the terminating hydrogen. Metal is selectively deposited on the portion terminated with left hydrogen atoms.
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The following US application
U.S. pat. 5,476,815, Dec. 1995, filed on Jul. 19, 1994.
US 5,492,734, Feb. 20, 1996, filed on Jun. 17, 1995.
U.S. pat. 5,438,218 Aug. 1995 filed on Apr. 30, 1993.
Akino Yutaka
Asaba Tetsuo
Fujita Kei
Kamei Seiji
Kayaoka Yuzo
Conon Kabushiki Kaisha
Tsai H. Jey
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