Method of forming a capacitor for a semiconductor device

Semiconductor device manufacturing: process – Making passive device – Stacked capacitor

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438253, H01L 218242

Patent

active

059536187

ABSTRACT:
A method of forming a capacitor for a semiconductor memory device, includes the steps of forming first and second insulating layers to form a first contact hole on a substrate, forming a first conductive layer and a third insulating layer within the first contact hole so as to define a second contact hole, forming a second conductive layer within the second contact hole, removing the second and third insulating layers to form a storage electrode, and forming a dielectric layer and a third conductive layer on the storage electrode to form a capacitor.

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patent: 5801079 (1998-09-01), Takaishi
patent: 5821139 (1998-10-01), Tseng
patent: 5849617 (1998-12-01), Wu

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