Method of forming a capacitor assembly in a circuit board

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S833000, C029S834000, C029S852000, C029S840000, C174S260000, C361S763000

Reexamination Certificate

active

11007010

ABSTRACT:
A circuit board includes an assembly having first and second power reference plane layers, and an insulator layer between the first and second power reference plane layers. Discrete decoupling capacitors are further provided with the assembly. Additional layers are provided above and below the assembly.

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patent: 6998308 (2006-02-01), Ooi et al.
U.S. Appl. No. 10/630,886, filed Jul. 30, 2003, Alexander et al.
U.S. Appl. No. 10/670,829, filed Sep. 25, 2003, Jun Fan et al.

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