Method of forming a bump electrode and manufacturing a resin-enc

Details Method of forming a bump electrode and manufacturing a resin-enc Method of forming a bump electrode and manufacturing a resin-enc

1991-09-17

1992-12-22

Seidel, Richard K.

Metal fusion bonding

Process

Plural joints

228 45, H01L 21607, B23K10140

Patent

active

051728516

ABSTRACT:
A bump electrode having a protrusion is formed. The protrusion is made of a folded wire whose tail is bonded to a cavity on the base of the bump electrode. A method of manufacturing a resin-sealed semiconductor device encapsulating a chip equipped with bump electrodes is also presented.

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patent: 4886200 (1989-12-01), Tsumura
patent: 5060843 (1991-10-01), Yasuzato et al.

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