Method of forming a bump electrode and manufacturing a resin-enc

Details Method of forming a bump electrode and manufacturing a resin-enc Method of forming a bump electrode and manufacturing a resin-enc

1992-08-28

1994-04-05

Bradley, Paula A.

Metal fusion bonding

Process

Plural joints

29841, B23K 3102

Patent

active

052997294

ABSTRACT:
A method of making a bump electrode having a protrusion. The protrusion is made of a folded wire whose tail is bonded to a cavity on the base of the bump electrode. A method of manufacturing a resin sealed semiconductor device encapsulating a chip equipped with bump electrodes is also presented.

REFERENCES:
patent: 4362902 (1982-12-01), Grabbe
patent: 4711700 (1987-12-01), Cusack
patent: 4717066 (1988-01-01), Goldenberg et al.
patent: 4857483 (1989-08-01), Steffen et al.
patent: 5014111 (1991-05-01), Tsuda et al.
patent: 5159750 (1992-11-01), Dutta et al.
patent: 5160409 (1992-11-01), Moore et al.

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