Package making – Methods – Forming or partial forming a receptacle and subsequent filling
Reexamination Certificate
2008-03-04
2008-03-04
Gerrity, Stephen F. (Department: 3721)
Package making
Methods
Forming or partial forming a receptacle and subsequent filling
C053S471000, C053S478000, C428S035700, C428S035800
Reexamination Certificate
active
10958564
ABSTRACT:
Blister packages are provided which are formed from multilayered films having a lid-stock film which is heat sealed directly to a fluoropolymer film. A polymeric base layer is adhered to a fluoropolymer layer via a first intermediate adhesive tie layer; a support layer is adhered to the fluoropolymer layer via a second intermediate adhesive tie layer; and a metallic foil layer is adhered to the support layer via a third intermediate adhesive tie layer. The blister has a greatly improved moisture barrier over blister packages of the prior art.
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Blum John B.
Luciano Sandra E.
Beatus Carrie
Gerrity Stephen F.
Honeywell International , Inc.
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