Method of forming a ball grid array device

Details Method of forming a ball grid array device Method of forming a ball grid array device

2006-12-26

2006-12-26

Vu, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257S698000

Reexamination Certificate

active

07153723

ABSTRACT:
A method includes:A. providing a substrate having a first surface and a second surface, the first surface being adapted for mounting an electronic device thereon;B. forming a grid of electrically conductive vias extending from a region proximate the first surface to a region proximate the second surface, each via being one of a signal via, a ground via and a power via;C. removing at least one of the vias to form a void between at least one ground via and at least one power via; andD. connecting each of the at least one ground via proximate the void to one of the at least one power vias proximate the void with a filter device proximate the second surface of the substrate.

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