Measuring and testing – Fluid pressure gauge – Combined
Reexamination Certificate
2009-11-23
2011-11-22
Caputo, Lisa (Department: 2855)
Measuring and testing
Fluid pressure gauge
Combined
C073S753000
Reexamination Certificate
active
08061212
ABSTRACT:
A method of forming a sensor for sensing a physical property of a media. A substrate is provided having circuitry thereon including at least one electrical contact and a die is provided having disposed thereon corresponding electrical contacts and a sensing element for sensing a physical property of a media applied to said sensing element. One or more bonding ring or portions are arranged on the die. The die electrical contact(s) and bonding ring(s) can be bonded substantially simultaneously, with conductive bonding material, to the corresponding substrate electrical contact(s) and a surface of said substrate, respectively, to thereby form a sensor. The bonding ring(s) form a pressure seal. The substrate can include corresponding bonding ring(s). The die can include an ASIC for compensating temperature effects on said pressure sensor.
REFERENCES:
patent: 4548078 (1985-10-01), Bohrer et al.
patent: 4763098 (1988-08-01), Glenn et al.
patent: 5459351 (1995-10-01), Bender
patent: 6006607 (1999-12-01), Bryzek et al.
patent: 6076409 (2000-06-01), Bang
patent: 6140144 (2000-10-01), Najafi et al.
patent: 6311561 (2001-11-01), Bang et al.
patent: 6313529 (2001-11-01), Yoshihara et al.
patent: 6346742 (2002-02-01), Bryzek et al.
patent: 6351390 (2002-02-01), Mayer et al.
patent: 6351996 (2002-03-01), Nasiri et al.
patent: 6405597 (2002-06-01), Brouwer et al.
patent: 6555414 (2003-04-01), Vanfleteren et al.
patent: 6644125 (2003-11-01), Siess et al.
patent: 6732588 (2004-05-01), Mullenborn et al.
patent: 6844606 (2005-01-01), Logsdon et al.
patent: 6927482 (2005-08-01), Kim et al.
patent: 7141869 (2006-11-01), Kim et al.
patent: 7150195 (2006-12-01), Jacobsen et al.
patent: 7384818 (2008-06-01), Kim et al.
patent: 7538401 (2009-05-01), Eriksen et al.
patent: 7700414 (2010-04-01), San Antonio et al.
patent: 2004/0259325 (2004-12-01), Gan
patent: 19902450 (2000-08-01), None
Xiao et al., “A Pressure Sensor Using Flip-Chip on Low-Cost Flexible Substrate,” IEEE 51 Electronic Components and Technology Conference, 6 pages, May 29-Jun. 1, 2001.
Pan et al., “Flip Chip Electrical Interconnection by Selective Electroplating and Bonding,” Microsystem Technologies, vol. 10, pp. 7-10, 2003.
Tadigadapa et al., “Applications of High-Performance MEMS Pressure Sensors Based on Dissolved Wafer Process,” Integrated Sensing Systems, Inc., 6 pages, Prior to Sep. 27, 2005.
Caputo Lisa
Honeywell International , Inc.
Jenkins Jermaine
Seager Tufte & Wickhem LLC
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