Method of flip chip mounting pressure sensor dies to...

Measuring and testing – Fluid pressure gauge – Combined

Reexamination Certificate

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C073S753000

Reexamination Certificate

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08061212

ABSTRACT:
A method of forming a sensor for sensing a physical property of a media. A substrate is provided having circuitry thereon including at least one electrical contact and a die is provided having disposed thereon corresponding electrical contacts and a sensing element for sensing a physical property of a media applied to said sensing element. One or more bonding ring or portions are arranged on the die. The die electrical contact(s) and bonding ring(s) can be bonded substantially simultaneously, with conductive bonding material, to the corresponding substrate electrical contact(s) and a surface of said substrate, respectively, to thereby form a sensor. The bonding ring(s) form a pressure seal. The substrate can include corresponding bonding ring(s). The die can include an ASIC for compensating temperature effects on said pressure sensor.

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Xiao et al., “A Pressure Sensor Using Flip-Chip on Low-Cost Flexible Substrate,” IEEE 51 Electronic Components and Technology Conference, 6 pages, May 29-Jun. 1, 2001.
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