Method of flexibly coupling a drive shaft

Metal working – Method of mechanical manufacture – Assembling or joining

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Details

29 2502, 414 8, 464 38, 464 79, 464157, 901 25, 901 28, B23P 1100

Patent

active

050018248

ABSTRACT:
In semiconductor vacuum processing, it is desirable to minimize the material handling mechanisms that must be located in the evacuated process chamber. To accomplish this, a mechanism has been designed that locates the necessary power elements such as motors (12-16) outside the chamber (32). Power is transmitted to the mechanism via commercially available rotary vacuum feed-through devices (30) mounted in the chamber walls (28) and the separable, zero backlash couplings (44) located within the chamber. These couplings (44) allow easy removal and replacement of the handling mechanism without the need for physical access and tools.

REFERENCES:
patent: 1126219 (1915-01-01), Hupp
patent: 2914929 (1959-12-01), Irons
patent: 3232076 (1966-02-01), Sundt
patent: 4655655 (1987-04-01), Schurfeld
patent: 4721492 (1988-01-01), Maurer

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