Method of fixing insertion electrode panel in compression-bonded

Details Method of fixing insertion electrode panel in compression-bonded Method of fixing insertion electrode panel in compression-bonded

1984-12-18

1985-12-24

Lowe, James

Metal working

Method of mechanical manufacture

Electrical device making

29589, 29759, 29834, 264259, 26427217, 357 39, H01L 2160

Patent

active

045596972

ABSTRACT:
A method of fixing an insertion electrode panel in a compression-bonded semiconductor device, in which a screen (20) having a pattern portion (22a) is aligned on a semiconductor element (1) having an electrode pattern (3), which pattern portion (22a) is formed identically to the electrode pattern (3), a cold-setting silicon rubber solution is dropped on the screen to be attached on the electrode pattern, whereby an aligning pattern member (23) is formed in a projecting manner, and then the insertion electrode panel (4) is overlapped on the semiconductor element in alignment with the same with the pattern hole (5) fitted with the aligning pattern member, and is fixed to the same by attaching a passivation rubber member (6) on its outer circumferential portion.

REFERENCES:
patent: 4040170 (1977-08-01), Schlegel et al.
patent: 4352118 (1982-09-01), Temple

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