Method of finishing board with thick resin film for making under

Details Method of finishing board with thick resin film for making under Method of finishing board with thick resin film for making under

1997-08-14

1999-03-02

Crispino, Richard

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156245, 156267, 1563317, 427483, 427485, 427355, 427421, 427428, B05D 102, B05D 104, B29C 3902, B32B 3112

Patent

active

058765433

ABSTRACT:
Thick molded strips of unsaturated polyester resin are bonded to butt edges of a panel member, upper and lower edge portions of the thick molded strips are cut so as to make upper and lower edge surfaces coplanar with upper and lower surfaces of the panel member, the coplanar surface is, thereafter, coated with the unsaturated polyester resin, and the polyester resin film and the thick molded strips are, finally, trimmed with a polisher; even though the molded strips are decreased in thickness through the polishing, the molded strips are thick enough to make the butt edges of the panel invisible, and the appearance of the board member is improved.

REFERENCES:
patent: 3907624 (1975-09-01), Gravely, Jr.
patent: 4637954 (1987-01-01), Ohsumi
patent: 4890656 (1990-01-01), Ohsumi et al.
patent: 5183090 (1993-02-01), McClung et al.

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