Method of finishing a printed wiring board with a soft etching s

Details Method of finishing a printed wiring board with a soft etching s Method of finishing a printed wiring board with a soft etching s

1995-06-07

1998-09-08

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

216 17, 427 97, 430318, H05K 310

Patent

active

058027149

ABSTRACT:
The invention presents a method of finishing a printed circuit board by using a soluble chloride added to a soft etching solution, the soluble chloride provides a source of chloride ions that beneficially combine with plated copper to form a protective CuCl layer. The protective layer is desirably used to prevent overetching of a copper film in a via or through-hole of a printed wiring board.

REFERENCES:
patent: 3675318 (1972-07-01), Merkenschlager
patent: 5028513 (1991-07-01), Murakami et al.
patent: 5358602 (1994-10-01), Sutcliffe et al.
patent: 5445698 (1995-08-01), Takano et al.
patent: 5504992 (1996-04-01), Fukutomi et al.
"Manufacturing Methods of a Printed Circuit Board," edited and issued by the Association of Japan Printed Circuit Industry (a corporation) (Dec. 1, 1989), pp. 109-111.

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