Metal working – Method of mechanical manufacture – Electrical device making
Patent
1991-03-15
1992-07-28
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
174263, 228 33, 427 97, B23F 1900
Patent
active
051331209
ABSTRACT:
To achieve the above object, the invention provides a novel method of filling through holes of a printed wiring board with conductive filler material by initially feeding compressed air to the conductive filler material by initially feeding compressed air to the conductive filler material across mask in the direction of through holes so that pressurized conductive filler material can be filled into through holes from a conductive-material extruding nozzle unit.
It is suggested that such silk screen be used for the mask, which is provided with through holes at positions corresponding to the positions of these through holes of the printed wiring board.
It is also suggested that such a nozzle assembly unit be used, which incorporates a conductive-material storing chamber and a nozzle tip member at the tip of this chamber, and yet, a conductive-material supply unit is connected to an operating unit of an extrusion valve in the chamber so that the conductive filler material can be delivered to the tip of the nozzle assembly unit.
It is also suggested that a dolly unit be used at a position corresponding to the mask composed of silk screen.
Furthermore, it is suggested that solvent-free conductive filler material be used.
REFERENCES:
patent: 4478882 (1984-10-01), Roberto
patent: 4622239 (1986-11-01), Schoenthaler et al.
patent: 4646057 (1987-02-01), Reynolds
patent: 4720402 (1988-01-01), Wojcik
patent: 4732780 (1988-03-01), Mitoff et al.
patent: 4808435 (1989-02-01), Cropp et al.
IBM Tech. Disclosure Bulletin, vol. 14, No. 9, Feb. 1972, pp. 2691-2692 by J. A. Lau et al. (29/852).
Haruyama Satoshi
Kawakami Shin
Okonogi Hirotaka
Adams Bruce L.
Arbes Carl J.
Nippon CMK Corp.
Wilks Van C.
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