Fishing – trapping – and vermin destroying
Patent
1995-03-28
1996-04-16
Weisstuch, Aaron
Fishing, trapping, and vermin destroying
136256, 216 52, 257466, 437 5, 437226, 437249, H01L 3118
Patent
active
055082068
ABSTRACT:
Thin semiconductor devices, such as thin solar cells, and a method of fabricating same are disclosed. A microblasting procedure is employed to thin a semiconductor wafer or substrate, such as a solar cell wafer, wherein fine abrasive particles are used to etch away wafer material through a mask. Thick areas remain at the perimeter of the semiconductor device or solar cell, in regions of the semiconductor device or solar cell behind the front interconnect attachment pads, and at corresponding rear interconnect attachment areas. In addition, there are thick areas in a pattern that comprise interconnected beams that support the thin wafer areas. Consequently, predetermined areas of the wafer are thinned to form a predetermined structural pattern in the wafer that includes an external frame and a plurality of interconnected beams. The final configuration of the semiconductor device or solar cell has approximately 20% of the area at the original wafer thickness with the remaining 80% etched away to a relatively thin thickness.
REFERENCES:
patent: 3971672 (1976-07-01), Lampkin
patent: 5017243 (1991-05-01), Otsubo
patent: 5397400 (1995-03-01), Matsuno et al.
Cavicchi B. Terence
Glenn Gregory S.
Denson-Low W. K.
Gudmestad Terje
Leitereg Elizabeth E.
Spectrolab, Inc.
Weisstuch Aaron
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