Method of fabrication of semiconductor integrated circuit...

Semiconductor device manufacturing: process – Miscellaneous

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C414S935000

Reexamination Certificate

active

07098156

ABSTRACT:
The conveyance of wafers in bays (equipment groups) of a clean room is performed by RGVs (Rail Guided Vehicles) that linearly travel at high speed on conveying rails laid on the floor of the clean room. A structure is adopted wherein a conveying area, over which the RGV travels, is separated from a human working area by a compartment (partition), and a human is not allowed to enter the conveying area upon operation of a line.

REFERENCES:
patent: 2002/0025244 (2002-02-01), Kim
patent: 63-37628 (1988-02-01), None
patent: 5-3240 (1993-01-01), None
patent: 6-236914 (1994-08-01), None
patent: 9-36198 (1997-02-01), None
patent: 11-330197 (1999-11-01), None
patent: 2001-102427 (2001-04-01), None
International Search Report for PCT/JP02/03391.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of fabrication of semiconductor integrated circuit... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabrication of semiconductor integrated circuit..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabrication of semiconductor integrated circuit... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3687173

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.