Method of fabrication of a circuit board adapted to receive a si

Details Method of fabrication of a circuit board adapted to receive a si Method of fabrication of a circuit board adapted to receive a si

1994-09-30

1996-12-10

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 22818021, H01K 310

Patent

active

055818773

ABSTRACT:
A mounting for a single in-line package (SIP) module includes an elongated slot aperture for receiving an edge of the module. The module may be a circuit board or other electrical device and preferably includes edge finger connectors. The elongated slot aperture preferably includes hemicylinders located about the periphery. The hemicylinders provide plated through conductors for connecting to the finger connectors of the module. The aperture is made according to an advantageous method in which the aperture is etched in order to remove barbs or extra copper material caused by milling the aperture. Preferably, the module fits into the aperture with an interference or size-on-size fit. The aperture may include strain relief areas.

REFERENCES:
patent: 4693408 (1987-09-01), Dines et al.
patent: 4700272 (1987-10-01), Bellamy
patent: 5297000 (1994-03-01), Freige et al.
patent: 5313699 (1994-05-01), Freige et al.
patent: 5321585 (1994-06-01), Trittschuh, III et al.

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