Method of fabrication of a chip carrier package, a flush-contact

Details Method of fabrication of a chip carrier package, a flush-contact Method of fabrication of a chip carrier package, a flush-contact

1986-10-02

1989-09-05

Hille, Rolf

357 80, 357 74, H01L 2312, H01L 2330, H01L 2348

Patent

active

048643831

ABSTRACT:
A micromodule or chip carrier package for chip containing components has an insulating support base for carrying a series of flush-mounted contact areas. A semiconductor circuit or chip is placed on one of the contact areas and the chip is connected to the other contact areas by means of wires. A hollow case is mounted over the assembly and has a bore for receiving a drop of resin which has the function of protecting the semiconductor circuit or chip.

REFERENCES:
patent: 4056681 (1977-11-01), Cook, Jr.
patent: 4138691 (1979-02-01), Bonkohara et al.
patent: 4323914 (1982-04-01), Berndmaier et al.
patent: 4532419 (1985-07-01), Takeda

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