Method of fabrication MEMS integrated circuits

Details Method of fabrication MEMS integrated circuits Method of fabrication MEMS integrated circuits

2007-06-15

2009-10-20

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Manufacture of electrical device controlled printhead

Reexamination Certificate

active

07605009

ABSTRACT:
A method of fabricating a plurality of MEMS integrated circuits from a wafer having a MEMS layer formed on a frontside thereof and a polymer coating over said MEMS layer, said polymer coating having a plurality of frontside dicing streets defined therethrough, said method comprising the steps of:(a) releasably attaching a first holding means to said polymer coating; and(b) performing at least one operation on a backside of the wafer, said at least one operation including etching a plurality of backside dicing streets through the wafer, each backside dicing street meeting with a respective frontside dicing street, thereby providing the plurality of MEMS integrated circuits releasably attached to said first holding means,wherein each MEMS integrated circuit comprises a respective polymer coating.

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