Method of fabrication for electro-optical devices

Fishing – trapping – and vermin destroying

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437227, 437129, H01L 21302

Patent

active

054181909

ABSTRACT:
A method of fabricating a semiconductor electro-optical device in which a cleaving apparatus is used to separate the wafer into bars of semiconductor material by striking the wafer from the epitaxial side, directly beneath the substrate side scribe mark. A series of angularly shaped trenches are etched across the epitaxial side of the semiconductor bars to permit bar separation into individual devices that allows a plurality of bars to be processed simultaneously.

REFERENCES:
patent: 4236296 (1980-12-01), Woolhouse et al.
patent: 4237601 (1980-12-01), Woolhouse et al.
patent: 4604161 (1986-08-01), Araghi
patent: 4904617 (1990-02-01), Muschke
patent: 5314844 (1994-05-01), Imamura

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