Method of fabrication for a thermal spreader using thermal...

Details Method of fabrication for a thermal spreader using thermal... Method of fabrication for a thermal spreader using thermal...

2004-09-29

2008-12-02

Lee, Edmund H. (Department: 1791)

Plastic and nonmetallic article shaping or treating: processes

With severing, removing material from preform mechanically,...

Dividing work to form plural articles

C264S158000, C264S261000, C264S275000

Reexamination Certificate

active

07459112

ABSTRACT:
A thermal spreading device disposable between electronic circuitry and a heat sink includes a substrate having parallel first and second faces and conduits extending through the substrate between the faces. The substrate material has a first thermal conductivity value in a direction parallel to the faces and a second thermal conductivity value in a direction normal to the faces, with the second thermal conductivity value being less than the first thermal conductivity value. The conduit material has a thermal conductivity value associated with it, with the thermal conductivity value being greater than the second thermal conductivity value of the substrate. One method of fabricating the thermal spreading device includes disposing a molding material radially about the rods and hardening the material. Other methods include press fitting and shrink fitting the rods into a substrate material.

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