Method of fabrication an inverse open frame alignment mark

Details Method of fabrication an inverse open frame alignment mark Method of fabrication an inverse open frame alignment mark

1994-07-01

1995-03-28

Powell, William

Fishing, trapping, and vermin destroying

156643, 156626, 1566591, 156662, 437 8, 437225, H01L 21465, H01L 21306, B44C 122

Patent

active

054016916

ABSTRACT:
A method for forming an alignment mark during semiconductor device manufacturing. A first area and a second area are provided on the semiconductor substrate wherein the second area is adjacent to the first area. An alignment mark is formed in the first area. A first layer is formed over the first area and the second area wherein the alignment mark is replicated in the first layer. The first layer is then removed from the second area and left over the first area. A globally planarized second layer, is formed over the first area and the second area. The second layer is then removed from the first area and is left over the second area.

REFERENCES:
patent: 4125418 (1978-11-01), Vinton
patent: 4632724 (1986-12-01), Chesebro et al.
patent: 5298110 (1994-03-01), Schoenborn et al.
patent: 5332470 (1994-07-01), Crotti

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