Method of fabricating turning mirror using sacrificial...

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal

Reexamination Certificate

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C438S027000, C438S031000, C257SE31001, C257SE31127

Reexamination Certificate

active

07611914

ABSTRACT:
The present invention is a method of fabricating a waveguide using a sacrificial spacer layer. The first step in this process is to fabricate the underlying optical semiconductor structure. A trench is then etched in this structure resulting in an underlying L-shaped structure. A sacrificial spacer layer is deposited in the trench. The waveguide is created in the trench on the sacrificial spacer layer using a mask layer to angle the vertex of the L-shaped structure. User-defined portions of the sacrificial spacer layer are subsequently removed to create air gaps between the waveguide and the sidewalls of the trench in the optical semiconductor.

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patent: 2005/0054131 (2005-03-01), Wada et al.
U.S. Appl. No. 09/412,682, filed Nov. 1, 2001, Smith et al.
Wan Thai Hsu et al., “A Sub-Micron Capacitive Gap Process for Multiple-Metal-Electrode Lateral Micromechanical Resonators”, Technical Digest, 14th International IEEE Micro Electro Mechanical Conterence, Jan. 2001.
S. Rennon et al., “12μm long edge-emitting quantum-dot laser”, Electronics Letters, May 2001.
Akiyama, Shoji et al., “Air Trench Bends and Splitters for Dense Optical Integration in Low Index Contrast,” Journal of Lightwave Technology, Jul. 2005.

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