Method of fabricating through-holed wiring board

Details Method of fabricating through-holed wiring board Method of fabricating through-holed wiring board

1996-09-23

1999-03-16

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29 907, 29DIG36, 216 17, 216 65, 264156, 264162, 451 78, H05K 342, B24C 104

Patent

active

058814558

ABSTRACT:
A method of fabricating a through-holed wiring board comprising a step of forming a through hole in a ceramic wiring board with a laser beam, and a step of removing an alteration layer, defined on an inner wall portion of the through hole by solidification after thermal melting, by sandblasting.

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