Method of fabricating thick film electrical components

Details Method of fabricating thick film electrical components Method of fabricating thick film electrical components

1985-12-31

1986-10-28

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 96, 427102, 427103, 4273762, 4273763, 156643, H05K 312

Patent

active

046198369

ABSTRACT:
A method is disclosed for fabricating thick film electrical components which are exceptionally uniform in electrical properties and have increased density wherein a thick film ink comprised of (i) an organic vehicle which is reactive with a plasma to form gaseous reaction products at a temperature below its thermal decomposition temperature, (ii) a glass frit having a glass transition temperature above the thermal degradation temperature, and (iii) a particulate material having the desired electrical properties for the thick film electrical component are applied to a suitable substrate in a pattern corresponding to the electrical component. The applied layer is then subjected to a suitable plasma at a temperature below the thermal degradation temperature for a time sufficient to remove the organic vehicle from the applied layer. The resultant layer is then heated at or above the glass transition temperature of the glass frit until the glass frit fuses and forms a composite with the particulate material.

REFERENCES:
patent: 3935330 (1976-01-01), Smith et al.
patent: 4201579 (1980-05-01), Robinson et al.
patent: 4241165 (1980-12-01), Hughes et al.
patent: 4278753 (1981-07-01), Lewis et al.
patent: 4341820 (1982-07-01), Taylor
patent: 4369254 (1983-01-01), Prabhu
patent: 4511601 (1985-04-01), Akse
patent: 4551357 (1985-11-01), Takeuchi
patent: 4555303 (1985-11-01), Legge
M. Leahy, "Plasma Etching for Integrated Circuit Fabrication," RCA Engineer, 30-5, Sep./Oct. 1985, pp. 75-82.

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