Method of fabricating thermal printing head

Details Method of fabricating thermal printing head Method of fabricating thermal printing head

1973-12-10

1976-04-13

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

101 31, 156155, 156235, 156240, 156277, 219216, 346139C, 427 96, 427123, 427125, 427149, 427152, 428901, B32B 3126, C03C 1722, G01D 1520, H05B 316

Patent

active

039502007

ABSTRACT:
A method of fabricating a thermal printing head by printing a circuit pattern of resistive elements and electric conductors on one surface of a flat paper sheet, covering the circuit pattern and surface of the flat paper sheet with a carrier layer of a substantially transparent methacrylic acid resin, peeling off the flat paper sheet, placing the remaining carrier layer carrying the circuit pattern over a surface of a pre-shaped insulating substrate with the circuit pattern being laid downward, and heating the carrier layer placed on the substrate to cause the carrier layer to be burned off and cause the circuit pattern to adhere to the surface of the substrate.

REFERENCES:
patent: 2351933 (1944-06-01), Decker et al.
patent: 2512929 (1950-06-01), Galbraith et al.
patent: 2629670 (1953-02-01), Rathke
patent: 3240642 (1966-03-01), Gaudio
patent: 3279969 (1966-10-01), Borchardt
patent: 3574029 (1971-04-01), Ettre
patent: 3615980 (1971-10-01), Schuck et al.
patent: 3655496 (1972-04-01), Ettre et al.

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