Method of fabricating suspended beam in a MEMS process

Details Method of fabricating suspended beam in a MEMS process Method of fabricating suspended beam in a MEMS process

2007-12-04

2007-12-04

Hoang, Quoc (Department: 2818)

Semiconductor device manufacturing: process

Manufacture of electrical device controlled printhead

C347S020000, C257SE21613

Reexamination Certificate

active

11246684

ABSTRACT:
A method of fabricating a suspended beam in a MEMS process, said method comprising the steps of:(a) etching a pit in a substrate, said pit having a base and sidewalls;(b) depositing sacrificial material on a surface of said substrate so as to fill said pit;(c) removing said sacrificial material from a perimeter region within said pit and from said substrate surface surrounding said pit;(d) reflowing remaining sacrificial material within said pit such that said remaining sacrificial material contacts said sidewalls;(e) depositing beam material on said substrate surface and on said reflowed sacrificial material; and(f) removing said reflowed sacrificial material to form said suspended beam.

REFERENCES:
patent: 6672710 (2004-01-01), Silverbrook et al.
patent: 7140084 (2006-11-01), Yamada et al.
patent: 2003/0146464 (2003-08-01), Prophet
patent: 2004/0100532 (2004-05-01), Silverbrook

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