Method of fabricating substrate with embedded component therein

Details Method of fabricating substrate with embedded component therein Method of fabricating substrate with embedded component therein

2006-11-19

2009-06-23

Thai, Luan C (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S126000, C438S106000, C438S127000

Reexamination Certificate

active

07550320

ABSTRACT:
A method of fabricating a substrate with an embedded component therein including the following steps is provided. First, a core layer having a first dielectric layer, a first patterned circuit layer, and a second patterned circuit layer is provided. The first patterned circuit layer and the second patterned circuit layer are disposed on an upper surface and a lower surface of the first dielectric layer, respectively. Then, a through hole is formed in the core layer. Next, the core layer is arranged on a supporting board and an embedded component having at least one electrode is disposed in the through hole. Afterward, a process of filling glue is carried out, such that the embedded component is fixed in the through hole. Thereafter, the supporting board is removed. Finally, the electrode of the embedded component is electrically connected to the second patterned circuit layer.

REFERENCES:
patent: 6865089 (2005-03-01), Ho et al.
patent: 7037750 (2006-05-01), Tsai et al.
patent: 7242092 (2007-07-01), Hsu
patent: 7262497 (2007-08-01), Fang

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