Method of fabricating substrate placing stage

Details Method of fabricating substrate placing stage Method of fabricating substrate placing stage

2008-04-08

2008-04-08

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

Bonding nonmetals with metallic filler

C228S234100, C228S245000

Reexamination Certificate

active

07353979

ABSTRACT:
A method of fabricating a substrate placing stage includes the step of providing a plate-shaped ceramic base having a substrate placing surface on a side of the ceramic base. The method includes the step of providing a plate-shaped ceramic base formed of a composite material containing components of a ceramic material and an aluminum alloy. The method includes the step of inserting a joint material including an aluminum alloy layer between the ceramic base and the cooling member. The method includes the step of heating the joint material at a temperature in a range from TS ° C. to (TS-30) °C. (TS °C.: a solidus temperature of the aluminum alloy). The method includes the step of pressing substantially normally joint surfaces of the ceramic base and the cooling member, thereby joining the ceramic base and the cooling member via the joint material to obtain a joint layer including the aluminum alloy layer having a thickness in a range from 50 μm to 200 μm after joining.

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