Method of fabricating semiconductor package

Details Method of fabricating semiconductor package Method of fabricating semiconductor package

2008-12-03

2010-10-12

Clark, S. V (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S125000

Reexamination Certificate

active

07811864

ABSTRACT:
A semiconductor package of this invention achieves higher wiring densities and increases the degree of freedom of the wiring design. The semiconductor package includes a first substrate having first and second faces, and first wiring provided on the first face of the first substrate. The semiconductor package also includes a second substrate having first and second faces, and second wiring provided on the first face of the second substrate. The semiconductor package also includes a semiconductor chip connected to the first and second wiring. The first face of the first substrate faces the first face of the second substrate, and the first and second wiring intersect one another in three dimensions in an isolated state.

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