Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Substrate dicing
Patent
1995-11-29
1998-06-09
Niebling, John
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Substrate dicing
66460, H01L 2120
Patent
active
057632901
ABSTRACT:
In a method of fabricating semiconductor laser chips using a circular semiconductor wafer, an orientation flat is formed at a part of the peripheral side surface of the semiconductor wafer so that an alignment error of the orientation flat from a crystalline axis of the semiconductor wafer is within.+-.0.04.degree.. Therefore, the processing precision in fabricating semiconductor laser chips using the circular wafer is improved.
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Mitsubishi Denki & Kabushiki Kaisha
Mulpuri S.
Niebling John
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