Fishing – trapping – and vermin destroying
Patent
1993-10-13
1995-06-20
Breneman, R. Bruce
Fishing, trapping, and vermin destroying
437228, H01L 2100, H01L 2102, H01L 21302, H01L 21463
Patent
active
054260736
ABSTRACT:
In wafer processes, after at least one layer which constitutes a structural member of a functional semiconductor element is formed on a semiconductor wafer, a brittle, excessive deposition on an edge of the semiconductor wafer is removed by grinding or etching of the wafer edge until the underlying wafer is exposed. The removal of the excessive deposition on the wafer edge reduces dust generation caused from crack and peel-off of the excessive deposition on the wafer edge, even if the wafer edge contacts a jig, and the like. Thus, the reduction in dust generation improves production yields of highly integrated semiconductor devices.
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Fujisawa Yoichi
Imaoka Kazunori
Breneman R. Bruce
Everhart B.
Fujitsu Limited
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