Method of fabricating semiconductor device with water protective

Details Method of fabricating semiconductor device with water protective Method of fabricating semiconductor device with water protective

1994-08-25

1996-04-30

Fourson, George

Fishing, trapping, and vermin destroying

437231, 437228, H01L 2144

Patent

active

055125131

ABSTRACT:
A semiconductor device includes an interlevel film constituted by a first dielectrics film containing dangling bonds and a bonded group of Si and hydrogen, and a second dielectrics film formed on the first dielectrics film.

REFERENCES:
patent: 4885262 (1989-12-01), Ting et al.
patent: 5003062 (1991-03-01), Yen
patent: 5106787 (1992-04-01), Yen
patent: 5204288 (1993-04-01), Marks et al.
patent: 5312512 (1994-05-01), Allman et al.
patent: 5364818 (1994-11-01), Ouellet
patent: 5376590 (1994-12-01), Machida et al.
patent: 5470798 (1995-11-01), Ouellet

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