Semiconductor device manufacturing: process – Making device array and selectively interconnecting – Using structure alterable to nonconductive state
Reexamination Certificate
2005-08-09
2005-08-09
Pert, Evan (Department: 2829)
Semiconductor device manufacturing: process
Making device array and selectively interconnecting
Using structure alterable to nonconductive state
Reexamination Certificate
active
06927100
ABSTRACT:
The semiconductor device comprises: an insulation film72having a contact hole74which reaches a substrate10formed in; an interconnection layer78connected to the substrate10through the contact hole74; a blocking layer80formed of the same conducting layer as the interconnection layer78; an insulation film82formed on the insulation film72; and fuses88formed on the insulation film82in a region where the blocking layer formed. This structure of the semiconductor device makes it possible that the blocking layer80for restraining the laser ablation to be formed without complicating the conventional semiconductor device fabrication steps.
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Armstrong Kratz Quintos Hanson & Brooks, LLP
Fujitsu Limited
Pert Evan
LandOfFree
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