Method of fabricating semiconductor device having a chip,...

Details Method of fabricating semiconductor device having a chip,... Method of fabricating semiconductor device having a chip,...

2006-08-22

2006-08-22

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S126000, C438S459000, C257S738000

Reexamination Certificate

active

07094630

ABSTRACT:
A plurality of chips are mounted on a substrate, coupling portions between the chips and the substrate are sealed, the chips have rear surfaces thereof collectively polished, and the substrate with the chips thereon are separated into independent semiconductor devices.

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