Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2009-03-27
2010-11-16
Chambliss, Alonzo (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S629000, C438S667000, C174S255000, C174S262000, C257S623000, C257S774000, C257SE23009, C257SE21502, C257SE25021
Reexamination Certificate
active
07833832
ABSTRACT:
A method for fabricating a semiconductor component with through interconnects can include the steps of providing a semiconductor substrate with substrate contacts, and forming openings from a backside of the substrate aligned with the substrate contacts. The method can also include the steps of providing an interposer substrate (or alternately a second semiconductor substrate), forming projections on the interposer substrate (or on the second semiconductor substrate), and forming conductive vias in the projections. The method can also include the steps of placing the projections in physical contact with the openings, and placing the conductive vias in electrical contact with the substrate contacts. The method can also include the steps of bonding the conductive vias to the substrate contacts, and forming terminal contacts on the interposer substrate (or alternately on one of the semiconductor substrates) in electrical communication with the conductive vias.
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Farnworth Warren M.
Hembree David R.
Wood Alan G.
Chambliss Alonzo
Gratton Stephen A.
Micro)n Technology, Inc.
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